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Tutorial at the 7x24 Exchange Conference,
Nov. 2006, Scottsdale, AZ
Our company president, Dr. Suhas V.
Patankar, will present a tutorial “Understanding Cooling Airflow” at the forthcoming 7x24 Exchange Conference in Scottsdale, AZ. The tutorial will deal with basic concepts in fluid mechanics and
how they relate to the airflow in data centers. A number of practical examples will be used to illustrate the application of the basic concepts. The full tutorial will be on Sunday, November 12,
2006, 3:00-5:00 PM; a shortened version of the tutorial will be presented on Monday, November 13, 2006, 3:45-5:15 PM. For more information, please see the conference brochure at
AFCOM Data Center World Conference, Sept. 10-13, Orlando, FL
Please visit our booth at the Data Center World
Expo. At the Expo, we also have two Product Information Sessions:
P02: Cooling Your Data Center: Part 1 -- Mysteries of the Under Floor (Monday, Sept. 11, 9:45 - 10:45 AM)
P07:
Cooling Your Data Center: Part 2: -- Wonders of the Above Floor (Tuesday, Sept. 12, 10:30 - 11:30 AM)
At this conference, we will introduce a new version of TileFlow.It includes a number of new
features including:
General
Toolbar Button to Maximize a View. The toolbar now contains a button to maximize the selected view.
Enhancements for the Under-Floor Simulation
Color Plot of Airflow Rates on the Data Center Floor. Now the color map of airflow rates through perforated tiles can be displayed on data center floor.
Color Plot of Under-floor Airflow and Pressure Distribution on the Data Center Floor. Now the color map of under-floor pressure distribution and under-floor airflow pattern can be displayed directly on the data
center floor.
Pressure/Velocity Gage to Display Local Under-Floor Velocities and Pressure. The pressure/velocity gage reports under-floor pressure and horizontal velocity at any location on the raised floor.
Enhanced Database of Perforated Tile Styles. The characteristics of perforated tiles and grates from Tate have been added to the database of Perforated Tile Styles.
Enhancements for the Above-Floor Simulation
Ability to Specify Rack Heat Load Distribution. A rack can be divided into any number of sections, and a section can be designated as a fan section (server), a blanking panel, or an
open section. For a fan section, you specify the heat load and the required airflow rate (or the air temperature rise).
Return Ceiling Plenum.
A new command has been added to create a ceiling plenum. All the CRAC units under the drop ceiling are then automatically connected to the ceiling plenum by return ducts.
Return Ducts for CRAC Units. Return ducts can be added on any CRAC unit. The return duct can be a Standard duct, which connects the CRAC unit to the drop ceiling,
or a Custom duct, which allows you to specify the vertical extent of the duct. The Standard duct option is available only when the ceiling plenum is present.
Vents on Horizontal and Vertical Partitions. Vents can be placed on vertical and horizontal partitions and on the drop ceiling. A vent can be fully open or have a grille attached
to it.
Ability to Paint Rack Tops According to Rack Inlet or Exit Temperatures. The top surfaces of racks can be painted according to the maximum rack inlet or exit temperatures.
Ability to Install IBM’s Cool Blue Heat Exchanger. On a front-to-rear rack, you can now install the IBM Cool Blue heat exchanger.
Click to download TileFlow brochure.
Announcing: Data Center Airflow Modeling Service
Our Airflow Modeling Service is designed to give you recommendations to achieve the best possible cooling in your data center.
We use computational analysis verified with actual airflow measurements. We show you how any changes will impact your data center before you implement them. Click here for details.
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