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MacroFlow is very
useful for rapid flow and thermal design of a variety of electronics systems. Use of MacroFlow involves representation of the flow and cooling system as a network of flow paths
through components such as screens, air or liquid filters, power supplies, card arrays, fans or pumps, ducts or tubes, bends, heat sinks or cold plates, and heat exchangers. MacroFlow
based analysis is very simple and fast in terms of model definition, computation, and examination of results.
Version 2.9 of MacroFlow
incorporates a number of enhancements in the component library and user interface. Examples of these include new components such as Impingement Heat Sink, Flow Map, Quick Disconnect,
and an enhanced specification of Orifice, Screen, and Screened Inlet/Exhaust components. These enhancements allow analysis of a wider variety of air and liquid-cooled electronics
systems and complex fluid delivery systems in semiconductor processing. Productivity of the flow and thermal design process is further facilitated by including component databases from leading
vendors of Gas Filters (Entegris, Mott Corporation
), Heat Exchangers (Lytron), Cold Plates (Lytron), Quick Disconnects
(Eaton Aeroquip), Fans (Dynamic Air Engineering,
Comair Rotron, JMC Products)
, Air Filters (Universal Air Filter), and by allowing saving of the user-defined characteristics into the database. More information about these
enhancements can be found by clicking here.
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