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Temperature fog (Three-dimensional temperature distribution above the raised floor)
Rack inlet temperature map
in a non-raised floor data center
The Cooling Challenge in Data Centers
Data centers are facilities that house computer servers, data storage systems, and telecommunications
equipment. To ensure that these computer systems operate reliably, they must be adequately cooled: The airflow requirement of each server rack must be met, in order to maintain the rack inlet air
temperatures within acceptable range.
The distribution of cooling air and the rack inlet temperatures (cooling performance) are controlled by
complex fluid dynamics processes and depend on a large number of parameters, which often interact in a counter-intuitive manner. In a raised-floor data center, these parameters include the layout of perforated
tiles, CRAC units, and server racks; the open area of perforated tiles; the heat loads of the racks; and, obstructions and blockages under and above the raised floor.
Often the design practices for data center cooling are based on empirical guidelines and prior experiences. These practices do not consider the complex fluid dynamic processes that control the
airflow and temperature distribution. Consequently, they lead to inefficient and ineffective data centers.
The key to designing an optimally cooled data center is a good understanding of the airflow patterns and temperature distribution in the data center. This understanding is best achieved through computer
modeling of the fluid flow and thermal processes, that is, by computer simulation of the cooling performance of the data center.
Animation of air movement above the raised floor (color represents local air temperature)
Display of cooling plumes through perforated tiles
TileFlow Offers a Scientific Approach for Meeting the Cooling Challenge in Data Centers
The current approach of achieving the desired cooling performance in a data center through trial and error is expensive and time consuming.
TileFlow offers a scientific, comprehensive, and cost-effective alternative involving computer simulation of the cooling performance of a data center.
TileFlow constructs a computer model of the data center and uses the technique of Computational Fluid Dynamics (CFD) to calculate:
- Airflow pattern and pressure distribution under the raised floor
- Distribution of airflow rates through perforated tiles and other openings on the raised floor
- Airflow pattern and temperature distribution above the raised floor (computer room)
TileFlow can be used to model both raised-floor and non-raised floor data centers. It accounts for the
effects of all important factors that influence the airflow patterns and temperature distribution, including
- Plenum and ceiling heights
- Location and flow rate of CRAC units
- Arrangement and open area of perforated tiles
- Cable openings on the floor
- Layout and heat load of server racks
- Under-floor obstructions
- Above-floor partitions and blockages
- Presence of overhead and rack-top cooling units
- Horizontal (in-row) coolers
- Overhead supply and exhaust vents
- Return ceiling plenum
Distribution of flow rates through perforated tiles
TileFlow: A Complete Design Tool for Airflow/Thermal Management in Data Centers
TileFlow is a reliable, quick, and cost-effective tool for:
- Designing new data centers
- Optimizing data-center configurations
- Rearranging and upgrading existing data centers
- Studying failure scenarios
- Identifying cooling problems (e.g., hot spots and short cycling) and evaluating possible solutions
For a given floor layout and specification of rack heat loads, TileFlow performs a computer simulation of
the data center and provides detailed information about the airflow patterns (under-floor and above-floor spaces) and temperature distribution in the data center. These results provide insight into cooling
problems, such as hot spots, and give guidance for their remediation.
TileFlow: A Fully Validated Airflow/Thermal Model for Data Centers
TileFlow results have been compared with measurements in laboratory-scale and real-life data centers.
The calculated flow rates and rack inlet temperature are in good agreement with the measued values. A representative comparison is shown here.
A representative comparison of measured airflow rates with TileFlow results
A representative comparison of measured rack inlet temperatures with TileFlow results
TileFlow: Powerful, Yet Easy-to-Use Airflow/Thermal Modeling Tool
TileFlow gives you the ability to calculate airflow and temperatures in even the most intricate data centers.
Yet, it is highly intuitive and delightfully easy to use. It includes an extensive library of CRAC units,
perforated tiles, and server racks from leading manufacturers. It can be used to model both raised-floor
and non-raised floor configurations. The results are easy to interpret and enable you to quickly visualize the cooling performance of your data center.
A simulation involving problem setup, airflow and temperature calculation, and result visualization can
often be completed within an hour. Subsequent simulations for modified layouts and failure scenarios take only minutes.
TileFlow is the software product of choice for simulating cooling performance of data centers. It is widely
used by data center managers, equipment manufacturers, architectural and engineering firms, and consulting companies.
Velocity vectors and pressure distribution under the raised floor
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